Tape Lamination

Tape lamination is a vital procedure in the manufacturing and packaging of semiconductor devices, providing a protective layer that safeguards delicate components during processing and handling. At GTI Technologies, we specialize in providing quality tape lamination services. This primary keyword plays a pivotal role in the industry, helping prevent contamination and damage from dust, moisture, and mechanical stress. By utilizing a tape lamination process, manufacturers can improve the durability and reliability of their products, ensuring that sensitive circuitry is preserved from the production floor to the end user. The importance of high-quality tape lamination in the semiconductor sector cannot be overstated, as it directly contributes to electronic devices' overall performance and longevity.

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What Are the Benefits of Tape Lamination?


The benefits of tape lamination in semiconductor manufacturing are manifold. By working with our renowned supplier of manufacturing equipment, businesses can achieve a secure and uniform application, which is essential for maintaining high standards throughout production. Tape lamination goes hand in hand with vacuum lamination techniques to ensure a bubble-free finish, a critical requirement for certain types of semiconductor equipment that demand the highest levels of precision.


Tape / Detape / Mount


Takatori produces a full line of equipment for protective tape lamination before back grinding, tape removal, and mounting onto dicing frames. Ready for the most demanding thin-wafer application, including Taiko wafers, Takatori has been producing tape, detape, and mounting equipment for over 25 years.

With the help of any of our film laminator varieties, manufacturers can apply a variety of films with varying degrees of adhesion and properties tailored to the protective or insulating layer required. In the context of wafer lamination, tape lamination secures wafers in place, protecting them during the aggressive processes of cutting and backgrinding, which further underscores its importance in the production cycle.

BACKGRIND TAPE LAMINATORS

These automatic wafer protective tape laminating machines laminate tape onto wafers before the backgrind process. Robust control of tape tension and other lamination conditions leads to high-quality lamination without defects for the best wafer quality after grinding. Some of the semiconductor equipment/ backgrind tape laminator machines we provide include the ATM-100G, ATM-31000, and TEAM-100.

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Machine  Wafer size  Lamination type  Throughput  Machine size (WxDxH) 
ATM-1100G    Up to 200mm  Atmospheric  Up to 90wph  1,200x1,140x1,645mm 
ATM-3100  Up to 300mm  Atmospheric -  1,350x1,650x2,020mm 
TEAM-100   Up to 300mm  Vacuum  Up to 50wph  1,400x1,000x1,650mm 

DETAPERS

These machines remove BG tape in fully automatic mode. They can handle the thinnest of wafers, including Taiko, and apply to various types of wafers and tape. Takatori also offers a unique “tapeless” detaping system, minimizing cost and waste. Examples of these machines that we have include:

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Machine Wafer size Delamination Throughput Machine size (WxDxH)
ATRM-2300 Up to 300mm Standard Up to 75wph 1,140x980x1,665mm
ATRM-2400UV Up to 200mm Standard Up to 75wph 1,000x980x1,800mm
ATRM-2400TKUV Up to 300mm Standard Up to 45wph 1,000x980x1,800mm
ATRM-2500UV Up to 200mm Tapeless/Stnd Up to 75wph 1,790x1,020x1,810mm
ATRM-4000 Up to 300mm Standard Up to 70wph 1,350x1,575x1,800mm
  • ATRM-2300TK - Optional on ATRM-2300 to be applicable for TAIKO wafers


  • ATRM-2400TKUV - New fully automatic film removal machine, applicable to TAIKO process. Integrated model with UV irradiation machine. 180-degree removal mechanism allows stable removal. The ATRM-2400 platform also presents a very small footprint, even with UV included.


  • ATRM-2400TKUV


  • ATRM-2500UV


  • ATRM-4000

FRAME MOUNTERS

These machines will mount wafers to dicing frames before the dicing process. Takatori’s unique vacuum lamination technology ensures the highest quality lamination with minimum force and no micro-bubbles. The flexible line of mounting machines can meet any need with various types of dicing tapes. The ones we have in stock include:

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Machine Wafer size Mounting Type Throughput Machine size (WxDxH)
ATM-12100 200mm,300mm Vacuum Up to 50wph 1,800x2,800x1,800mm
ATM-8100S Up to 300mm Vacuum Up to 80wph 1,830x1,300x1,800mm
ATM-8100TK Up to 200mm Vacuum Up to 23wph 2,000x1,700x1,850mm
ATM-8200A Up to 300mm Vacuum Up to 95wph 1,326x1,150x1,800mm
ATM-9000 Series Package Vacuum or Manual Up to 75wph 1,780x1,240x1,760mm
SAM-8 Up to 200mm Semiauto/Vacuum 35 sec/wafer 810x1,330x1,480mm
SAM-12 Up to 300mm Semiauto/Vacuum Approx.20wph 1,550x2,000x1,800mm
  • ATM-8100TK - Applicable to Taiko process


  • ATM-8200A - Full-Automatic wafer mounter with the smallest in the world. Applicable to the thinner wafer (thickness: 200μm/8 inches) by using a chamber.


  • ATM-9000 Series - Mount rectangular packaging substrates on a dicing ring in a vacuum state in the fully automatic mode. Multiple package lamination is available. It is also applicable to ECO rings, laminating without wasting tape.


  • SAM-8, SAM-12 - Semi-automatic wafer mounter mounts wafer and tape on film frame for the dicing process.

Explore Options for Tape Lamination


When seeking protection for your products, learn more about us and explore the options we provide for tape lamination. Our advanced process solutions are designed to meet the unique requirements of your manufacturing operations. We encourage you to reach out for more information on our services and to gain insight into how our team can assist with your specific needs. Ready to take the next step in securing the best for your production line? Contact us today to learn more about our tape lamination services and get started on ensuring the highest quality and protection for your semiconductor components.

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