TAPE / DETAPE / MOUNT
Takatori produces a full line of equipment for protective tape lamination prior to back grinding, tape removal, and mounting onto dicing frames. Ready for the most demanding thin-wafer application, including Taiko wafers, Takatori has been producing tape, detape, and mounting equipment for over 25 years.
BACKGRIND TAPE LAMINATORS
These automatic wafer protective tape laminating machines laminate tape onto wafers before the backgrind process. Robust control of tape tension and other lamination conditions lead to high quality lamination without defects, for the best wafer quality after grind.
| Machine | Wafer size | Lamination type | Throughput | Machine size (WxDxH) |
|---|---|---|---|---|
| ATM-1100G | Up to 200mm | Atmospheric | Up to 90wph | 1,200x1,140x1,645mm |
| ATM-3100 | Up to 300mm | Atmospheric | - | 1,350x1,650x2,020mm |
| TEAM-100 | Up to 300mm | Vacuum | Up to 50wph | 1,400x1,000x1,650mm |
DETAPERS
These machines remove BG tape in fully automatic mode. They are capable of handling the thinnest of wafers, including Taiko, and applicable to various types of wafer and tape. Takatori also offers a unique “tapeless” detaping system, minimizing cost and waste.
| Machine | Wafer size | Delamination | Throughput | Machine size (WxDxH) |
|---|---|---|---|---|
| ATRM-2300 | Up to 300mm | Standard | Up to 75wph | 1,140x980x1,665mm |
| ATRM-2400UV | Up to 200mm | Standard | Up to 75wph | 1,000x980x1,800mm |
| ATRM-2400TKUV | Up to 300mm | Standard | Up to 45wph | 1,000x980x1,800mm |
| ATRM-2500UV | Up to 200mm | Tapeless/Stnd | Up to 75wph | 1,790x1,020x1,810mm |
| ATRM-4000 | Up to 300mm | Standard | Up to 70wph | 1,350x1,575x1,800mm |
*ATRM-2300TK:
Optional on ATRM-2300 to be applicable for TAIKO wafers
*ATRM-2400TKUV:
New fully automatic film removal machine, applicable to TAIKO process. Integrated model with UV irradiation machine. 180 degree removal mechanism allows stable removing. The ATRM-2400 platform also presents a very small footprint, even with UV included.
FRAME MOUNTERS
These machines will mount wafers to dicing frames before the dicing process. Takatori’s unique vacuum lamination technology ensures the highest quality lamination with minimum force and no micro-bubbles. The flexible line of mounting machines can meet any need with various types of dicing tapes.
| Machine | Wafer size | Mounting Type | Throughput | Machine size (WxDxH) |
|---|---|---|---|---|
| ATM-12100 | 200mm,300mm | Vacuum | Up to 50wph | 1,800x2,800x1,800mm |
| ATM-8100S | Up to 300mm | Vacuum | Up to 80wph | 1,830x1,300x1,800mm |
| ATM-8100TK | Up to 200mm | Vacuum | Up to 23wph | 2,000x1,700x1,850mm |
| ATM-8200A | Up to 300mm | Vacuum | Up to 95wph | 1,326x1,150x1,800mm |
| ATM-9000 Series | Package | Vacuum or Manual | Up to 75wph | 1,780x1,240x1,760mm |
| SAM-8 | Up to 200mm | Semiauto/Vacuum | 35 sec/wafer | 810x1,330x1,480mm |
| SAM-12 | Up to 300mm | Semiauto/Vacuum | Approx.20wph | 1,550x2,000x1,800mm |
ATM-8100TK:
Applicable to Taiko process
ATM-8200A:
Full-Automatic wafer mounter with the smallest in the world. Applicable to thinner wafer (thickness: 200μm/8inches) by the use of chamber.
ATM-9000 Series:
Mount rectangular packaging substrates on a dicing ring in vacuum state in the fully automatic mode. Multiple package lamination is available. It is also applicable to ECO ring, laminating without wasting tape.
SAM-8, SAM-12:
Semi-automatic wafer mounter which mounts wafer and tape on film frame for dicing process.
6 Armstrong Road, Shelton, CT 06484, USA
+1-203-929-2200