SPECIAL APPLICATIONS

Backside lamination, UV exposure, and more.

Takatori is ready to work with you on new applications as well, drawing on 30 years of experience with a wide variety of applications.

REMOUNTING

Takatori has developed a specialized tool for remounting wafers - in some processes, mounted wafers need to be moved from one frame or expansion ring to a new frame.

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TTM-200:

Remount wafers up to 200mm in a fully automated machine.


TTM-200A:

Adds wafer expansion to the TTM-200.


TTM-200C:

Wafer remounting with vacuum mounting.

BACKSIDE LAMINATION

Takatori’s technology will enable uniform irradiation on the entire surface of the dicing tape, and on the wafer equally.

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Machine Wafer Size Throughput Machine Size(WxDxH)
TEAM-100 Up to 200mm Up to 50wph 1400x1000x1650

TEAM-100 -Backside Lamination:
Apply tapes to the backside of wafers, with or without frontside contact, using the TEAM-100. Tape is precut and applied in a vacuum chamber, minimizing lamination force and protecting the front side of the wafer. The unique TEAM-100 lamination method, which separates tape cutting from lamination, means that even Taiko wafers can be laminated on the backside.

UV IRRADIATION EQUIPMENT

Takatori’s technology will enable uniform irradiation on the entire surface of the dicing tape, and on the wafer equally.

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Machine Frame Size Throughput Machine size (WxDxH)
TUV-1 2-6-1・2-8-1 Up to 100wph 1,440x1,200x1,580mm
TUV-12 2-8-1・2-12-1 Up to 100wph 1,760x1,340x1,570mm
TUV-M 2-6-1・2-8-1 --- 760x1,390x1,405mm

TUV-1, TUV-12:
Fully automatic tool for fast, efficient UV exposure of wafers up to 200m. Applicable to irradiate in a chamber as well.


TUV-M:
This semi-automatic machine will irradiate the UV to the dicing tape.


TUV-1T:

This machine enables to irradiate the UV equally on the dicing tape, and on the wafer. Even the UV lamp inside the tool deteriorates, by Takatori’s unique technology, it will not affect irradiation throughput.

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