SiC SLICING PLATFORMS

Takatori has been the leader in SiC slicing for almost 25 years, and recently they have developed a new platform to optimize the slicing of this very valuable material. The MWS-SiC6 builds on Takatori’s decades of wire saw experience to provide the highest quality slicing while reducing the material lost to slicing. Cutting wire diameter has been reduced to 0.100mm, saving 60um with each wafer over the former standard process.

The new tools offer some other improvements as well. Refined tension control and improved slurry management are both key to the new 0.100mm wire process, helped by a highly rigid machine body and a new control system. For further savings, the slicing quality off of the machine is excellent, reducing downstream processing and saving more material.

As the SiC market continues to grow there is significant pressure to lower costs. The SiC6 and SiCX will both enable this push by optimizing the number of wafers that can be produced from each ingot.