ADVANCED FILM LAMINATION

Takatori’s laminators are capable of laminating different types of films, as well as different types of lamination, including vacuum. Machines for backside lamination can even handle ultra thin wafers.

VACUUM LAMINATION

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Machine Wafer size Lamination type Machine size (WxDxH)
TEAM-100ARF Up to 200mm Vacuum 1,490x1,190x1,660mm
TEAM-300ARF Up to 300mm Vacuum 2,100x2,250x2,300mm
VTM-150M Up to 150mm Vacuum 1,300x750x1,750mm
VTM-200M 150, 200mm Vacuum 1,600x950x1,800mm
VTM-300 Up to 300mm Vacuum 1,690x2,950x1,850mm
VTM-300MA Up to 300mm Vacuum 1,870x1,150x1,850mm

TEAM-100ARF:
Full-Automatic Dry-resist film Laminator will laminate film in a vacuum chamber which will prevent bubbles on the film or damage to the wafer. The tool also separates tape cutting from lamination, allowing for “inner cut” lamination and making multi-layer lamination possible.


TEAM-300ARF:
Laminate dry photoresist and other advanced films for wafer bumping, MEMS, TSVs, and other advanced packaging applications. The machine laminates in the vacuum chamber for the highest quality and no micro-bubble, even around complex surface features. The machine also separates tape cutting from lamination, protecting the wafer edge and allowing a smaller diameter tape circle.


VTM-300A:
Takatori’s most capable, flexible laminator, the VTM series machines are capable of different types of lamination, including vacuum. The machine can be used to laminate different types of films, including dry film and non-conductive films (NCF).


VTM-300MA:
The semi-automatic version of the VTM-300A, the “M” version is manually loaded and features the same lamination capabilities as the fully automatic machine. This machine also adds the capability to mount wafers, making it a very flexible option.

ATMOSPHERIC LAMINATION

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Machine Wafer size Lamination type Throughput Machine size (WxDxH)
ATM-1100K Up to 200mm Atmospheric --- 1,030x1,340x1,750mm
ATM-1100KA Up to 200mm Up to 200mm --- 1,030x1,340x1,750mm
DM-800B 150, 200mm Atmospheric Up to 25wph 1,330x1,080x1,930mm
DM-812M 200, 300mm Atmospheric --- 1,350x910x1,250mm

ATM-1100K:
Takatori’s most advanced atmospheric laminator features highly refined temperature and pressure controls to ensure high quality lamination of advanced films.


ATM-1100KA:

The ATM-1100KA is cost effective solution for atmospheric lamination of dry films and other tapes. It features many of the same capabilities of the ATM-1100K, but is a simpler tool at a lower price. It is also a good solution for tenting applications. 

DM-800 Backside Lamination:
A specialized lamination tool for backside lamination of single layer die attach film (DAF) onto wafers. The machine is designed to safely handle wafers down to 50 microns, and to work with thin, delicate DAF tapes.


DM-812M:

The semi-automatic machine for dicing-die bonding film for up to 300mm wafer. Applicable for ultra thin wafers less than 50 microns with wafer support system.


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