Film Laminator

A film laminator is an invaluable tool in the world of material fabrication, providing a consistent and high-quality method for applying protective layers to various substrates. At GTI Technologies, we understand that laminators play a crucial role in extending the lifespan of printed materials, enhancing the vibrancy of colors, and protecting against environmental factors such as moisture and UV rays. For industries that depend on precise lamination, such as electronics and packaging, the suitable dry film laminator can drastically improve product durability and appearance, making it an indispensable asset in production.

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How to Use a Film Laminator


Operating a film laminator effectively involves understanding its mechanics and the types of lamination it can perform. In processes requiring dry film lamination, a film laminator must accurately apply layers without the use of solvents or liquids, which is a critical specification for certain electronic applications. The range of sophisticated equipment we provide as a renowned supplier of manufacturing equipment is designed to support these needs.

Vacuum lamination from The Takatori Team


When working with delicate semiconductor components, a reliable semiconductor equipment system capable of vacuum lamination ensures a bubble-free and firm adhesion. Moreover, our tape lamination processes are streamlined using our advanced film laminators. This is highly important as it enhances the protection and functionality of semiconductor wafers with precision wafer lamination techniques. Some of the vacuum lamination machines we offer include:

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Machine Wafer size Lamination type Machine size (WxDxH)
TEAM-100ARF Up to 200mm Vacuum 1,490x1,190x1,660mm
TEAM-300ARF Up to 300mm Vacuum 2,100x2,250x2,300mm
VTM-150M Up to 150mm Vacuum 1,300x750x1,750mm
VTM-200M 150, 200mm Vacuum 1,600x950x1,800mm
VTM-300 Up to 300mm Vacuum 1,690x2,950x1,850mm
VTM-300MA Up to 300mm Vacuum 1,870x1,150x1,850mm
  • TEAM-100ARF - Full-Automatic Dry-resistant film Laminator will laminate film in a vacuum chamber which will prevent bubbles on the film or damage to the wafer. The tool also separates tape cutting from lamination, allowing for “inner cut” lamination and making multi-layer lamination possible.


  • TEAM-300ARF - Laminate dry photoresist and other advanced films for wafer bumping, MEMS, TSVs, and other advanced packaging applications. The machine laminates in the vacuum chamber for the highest quality and no micro-bubble, even around complex surface features. The machine also separates tape cutting from lamination, protecting the wafer edge and allowing a smaller diameter tape circle.


  • VTM-300A - Takatori’s most capable, flexible laminator, the VTM series machines are capable of different types of lamination, including vacuum. The machine can laminate different types of films, including dry and non-conductive films (NCF).



  • VTM-300MA - The semi-automatic version of the VTM-300A, the “M” version, is manually loaded and features the same lamination capabilities as the fully automatic machine. This machine also adds the capability to mount wafers, making it a very flexible option.

ATMOSPHERIC LAMINATION


Besides vacuum lamination solutions, Takatori also offers another renowned lamination product for its customers. This process is known as atmospheric lamination. Do you want to learn more about us? Here are the different types of atmospheric lamination machines that we offer:

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Machine Wafer size Lamination type Throughput Machine size (WxDxH)
ATM-1100K Up to 200mm Atmospheric --- 1,030x1,340x1,750mm
ATM-1100KA Up to 200mm Up to 200mm --- 1,030x1,340x1,750mm
DM-800B 150, 200mm Atmospheric Up to 25wph 1,330x1,080x1,930mm
DM-812M 200, 300mm Atmospheric --- 1,350x910x1,250mm
  • ATM-1100K - Takatori’s most advanced atmospheric laminator features highly refined temperature and pressure controls to ensure high-quality lamination of advanced films.
  • ATM-1100 KA - The ATM-1100KA is a cost-effective solution for the atmospheric lamination of dry films and other tapes. It features many of the same capabilities as the ATM-1100K but is a simpler tool at a lower price. It is also a good solution for tenting applications.
  • DM-800 Backside Lamination - A specialized lamination tool for backside lamination of single-layer die attach film (DAF) onto wafers. The machine is designed to safely handle wafers down to 50 microns, and to work with thin, delicate DAF tapes.
  • DM-812M - The semi-automatic machine for dicing-die bonding film for up to 300mm wafer. Applicable for ultra-thin wafers less than 50 microns with a wafer support system.

Order Dry Film Lamination


Our top-of-the-line film laminators are here to provide the quality and reliability your project demands, especially when it comes to dry film lamination. With our cutting-edge technology, you can achieve flawless results and superior product durability, ensuring each layer adheres perfectly every time. Please contact us for personalized advice or assistance with selecting the right lamination solution. Our expert team is committed to helping you optimize your production process with industry-leading lamination technology.

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