MULTI WIRE SAWS

ABOUT

Multi wire saws are essential for the precision slicing required in semiconductor manufacturing. At GTI Technologies, we are known for the efficiency and ability to produce high volumes of wafers with uniform thickness, which is integral in producing high-quality electronic components. Innovations in multi wire saw technology have allowed for significant advancements in the semiconductor industry, ensuring that the wafers produced are cut to exact specifications with minimal material loss. Manufacturers can optimize their operations, reduce waste, and maintain a competitive edge in the fast-paced electronic market by selecting the best multi wire saws.

TAKATORI MULTI WIRE SAWS

Takatori is the world leader in slicing challenging materials using diamond wire or abrasive slurry. GTI and Takatori worked together to develop the first applications to slice sapphire and silicon carbide using wire saws, and today, Takatori saws are industry standards for both materials. From the beginning, Takatori gave their machines a unique “rocking” function, improving slicing quality. Almost all of today’s Takatori saws still have this feature, and it opens the door not just to higher quality but auto-winding, speeding up the turn-around of the machine. GTI and Takatori have helped customers achieve lower costs and higher productivity by slicing various materials, including SiC, sapphire, GaN, glass, ceramics, GaAs, GaP, quartz, Si, and more.

  • Why go with Wire Sawing?

    Going from your source material, whether a carefully grown, single crystal ingot, a perfectly produced and slowly annealed piece of glass, or a sintered block of high-tech ceramic, to a thin wafer with perfect geometry and a beautiful surface finish means losing material at every processing step. Wire sawing significantly reduces material loss in multiple steps, saving time, money, and material. Wire sawing reduces kerf loss (material lost during slicing) from the beginning. Wire sawing saves substantial material compared to traditional OD saws, ID saws, and other slicing methods.

     

    Typical kerf loss is < 0.200mm / 0.008” for slurry and ~0.250mm / 0.010” for diamond wire and can be even lower. Reduced kerf loss means more wafers for a given length of material, quickly lowering costs and improving productivity. In addition to the benefits of lower kerf loss, wire sawing also typically results in higher-quality cuts. TTV, bow, and warp are minimized, as are surface roughness and sub-surface damage. The improved “as-sliced” quality means that subsequent steps (grinding, lapping, and polishing) can be minimized, saving time and material. 


    The reduced processing requirement even means that wafers can be sliced to a thinner initial thickness, saving more material and improving yields. Additionally, we understand the evolving needs of metal processing, which is why we also offer advanced metal cutting wire options that guarantee efficiency and performance for a variety of applications. Contact us to learn more about how multi-wire saws from Takatori can help your company lower costs and improve productivity.


CHOOSE OUR INDUSTRY-LEADING MULTI WIRE SAWS

It's time to revolutionize your manufacturing process with our industry-leading multi-wire and dicing saws. By incorporating our superior technology your production line will see improved yield, greater precision, and enhanced cost-efficiency. Let us be the partner that elevates your operations to the next level. For more information on our products and services or to discuss how our saws can be integrated into your projects, please feel free to Contact us.