Wafer Bonding Using Double-Sided Tape
Machine | Wafer size | Throughput | Machine size (WxDxH) |
---|---|---|---|
GWS-300 | Up to 300mm | Up to 40wph | 2,400x2,400x1,800mm |
GWSM-300M | Up to 300mm | Up to 30wph | 700x1,200x1,600mm |
WSM-100 | Up to 200mm | Up to 40wph | 1,700x1,760x1,800mm |
WSM-200 | Up to 200mm | Up to 40wph | 1,800x1,800x1,800mm |
GWS-300:
The GWS is a fully automated solution for bonding wafers up to 300mm. Wafers are presented to the tool with adhesive already applied, and then wafers are bonded in a vacuum chamber for maximum quality.
GWSM-300M:
Manually loaded version of GWS-300. Bond wafers up to 300mm in a vacuum chamber.
WSM-100:
This machine is Takatori’s solution for temporary bonding of wafers up to 200mm using double sided tape. Choose heat release or UV release double sided tape to bond wafers in a quick, cost-effective process. Bonding occurs in a vacuum chamber to ensure the highest quality and eliminate bubbles.
WSM-200:
This machine is de-bonding and mounting solution for wafers up to 200mm. It first mounts wafers on a dicing frame using Takatori’s vacuum bonding technology, and then removes the carrier wafer using either heat or UV exposure (depending on the adhesive type).