GRINDING

GTI offers mulitple solutions for the grinding of hard, crystalline materials like SiC. The Takatori GLP tools provide a very rigid platform for wafer grinding of SiC and other hard materials. The Logomatic Q2 is a dedicated OD grinding platform for SiC ingots, featuring an unusually small footprint.

Takatori's grinding platforms are built for enhanced rigidity, leading to high wafer quality and high throughput even on the most demanding applications.

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Machine Work Size/Wafer Size Grinding Wheel Size Machine Dimensions (WxDxH)
GLP-150 Up to 150mm Max Φ300mm 900 x 2,280 x 1,940mm
GLP-200W Up to 200mm Φ200mm or Φ300mm 3,000 x 1,400 x 2,400mm
GLAPPING-SiC 200mm Φ280mm or Φ300mm 1,225 x 2,500 x 2,500mm

GLP-150:

This grinding machine is capable to grind hard brittle material like SiC, GaN, and sapphire. The machine will grind with heavy load, which leads to less grinding time, higher accuracy, and long life of grind stones. Grindstone will last longer with shorter grinding time by using non-dress grindstone. The machine uses graphical user interface (GUI) which is user-friendly, and able to set data flexibly.


GLP-200W:
This new grinding machine is 2-head and 3-tables model with high rigidity to grind hard and brittle material like SiC, GaN, LT/LN and sapphire. The machine also has a precise in-process gauge (non-contact in-process gauge as an option). It will have best function for grinding the laminated thin wafer etc. It has smaller motor capacity by using servo-motor, which also means less irregularity of spinning that leads to stabilization of grinding face.


GLAPPING-SiC

The latest wafer grinding platform from Takatori is their innovative Glapping machine. This tool is designed with Takatori's uniquely rigid structure, and adds enhanced automation features to improve performance.

LOGOMATIC Q2

SiC Boule Grinder

(including flat & notch)

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Machine Weight Electric Consumption Water Consumption Machine Dimensions
Logomatic Q2 4.5 tons 15kW 6000 Liters/Year 1600 x 1600 x 1900m
  • Logomatic’s specially designed Q2 External Cylindrical Grinding Machine is a fully automated, high-precision solution for processing SiC Boules. The tool has integrated Flat and Notch features for workpieces with 6 and 8 inch diameters. 
  • Dialogue-based control system allows even complex grinding operations to be simplified through multiple program selections. 
  • Based on prior X-ray measurements, the position for Flat & Notch is precisely determined and transferred into the tool. In-process monitoring technologies guarantee workpieces to be free from chipping or cracks. 
  • Efficiency of the tool reduces electricity and water consumption by more than 50% compared to modified competitor products, with compact footprint. 
  • With a compact footprint of only 2.56 m² (1.6 * 1.6m), the Q2 is the smallest machine of its kind worldwide. It allows for the installation of three Q2 machines in the space of one competitor machine.
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