VCSEL (vertical cavity surface emitting laser), once a niche technology, is now an emerging technology for many applications including chip-to-chip interconnect, touchless sensing, gesture recognition, and facial recognition used in phones and other mobile devices. VCSEL GaAs TAIKO and Non-TAIKO wafers are now widely processed for an array of applications and are used for communication links up to 500 meters in networks, enterprise, and data centers.
The entire VCSEL market has increased new fabrication, testing and validation processes. VCSEL technology continues to improve with demand from smartphone and tablet manufacturers. Automotive manufacturers will also rely on VCSEL for their LIDAR applications, which require high power where there are VCSEL arrays.
Over the past few years, Takatori and it Technologies have worked together to address the challenges which occur during the GaAs wafer manufacturing process. Takatori’s TEAM-100 laminator uses a unique vacuum lamination process which creates less stress than traditional atmospheric lamination resulting in improved yields. In addition, the ATRM 2300TK delaminator uses advanced handling and a unique removal process to safely remove tape from ultra-thin GaAs wafers.
Andre has served as Semiconductor Sales Manager for GTI Technologies since 2018. He brings over 25 years of front-end and back-end semiconductor and international business experience. He has successfully managed some of the world’s largest semiconductor chip makers. Andre has held sales and leadership roles at leading Japanese companies, including LINTEC, Ebara, and Teikoku.
Andre earned a BSc degree in Management and Marketing from University of Phoenix and a MSc degree in Leadership, Management, and Strategy from Michigan State University,
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of VSCEL GaAs wafers.