Come visit GTI Technologies this year at Semicon Europe to learn more about Takatori’s line of semiconductor process equipment. Temporary bonding, dry resist lamination, tape & detape for backgrinding, wafer mounting, and other applications are all handled by Takatori’s extensive line of equipment. We look forward to seeing you at the show.
For the first time co-located with productronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics supply chain. The co-location with productronica embodies the SEMI global strategy to connect the breadth of the entire electronics supply chain.
SEMICON Europa events will expand attendee opportunities to exchange ideas and promote technological progress featuring the most advanced and innovative electronics manufacturing platform in Europe.
Advanced equipment for material slicing
and semiconductor wafer processing
Precision grinding machines by Gioria and Curtis Machine Tools, and tool presetters and accessories from ALFA SYS.
Explore carbon fiber machines
from Takatori including the
robot wire saw.