SemiConWhtLogosmall

November 14-17, 2017 - Munich, Germany

Booth B1-155

Come visit GTI Technologies this year at Semicon Europe to learn more about Takatori’s line of semiconductor process equipment. Temporary bonding, dry resist lamination, tape & detape for backgrinding, wafer mounting, and other applications are all handled by Takatori’s extensive line of equipment. We look forward to seeing you at the show.

For the first time co-located with productronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics supply chain. The co-location with productronica embodies the SEMI global strategy to connect the breadth of the entire electronics supply chain.

SEMICON Europa events will expand attendee opportunities to exchange ideas and promote technological progress featuring the most advanced and innovative electronics manufacturing platform in Europe.

DISCOVER OUR PRODUCTS

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SEMICONDUCTOR

& ADVANCED MATERIALS

Advanced equipment for material slicing
and semiconductor wafer processing
from Takatori.

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METALWORKING

PRESETTERS & ACCESSORIES

Precision grinding machines by Gioria and Curtis Machine Tools, and tool presetters and accessories from ALFA SYS.

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COMPOSITES

CUTTING SOLUTIONS

Explore carbon fiber machines
from Takatori including the
robot wire saw.


  • Shows and Meeting Schedule

    1. CAMX 2017 – Rescheduled

      December 12 @ 9:30 am - December 14 @ 5:00 pm
    2. NEPCON – 2018 – R&D and Manufacturing

      January 17, 2018 @ 10:00 am - January 19, 2018 @ 5:00 pm
  • Contact GTI