The WSM-200 is a de-bonding and mounting solution for wafers up to 200mm. The machine first mounts wafers on a dicing frame using Takatori’s vacuum bonding technology, and then removes the carrier wafer using either heat or UV exposure (depending on the adhesive type).


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    1. CAMX 2017

      September 12 @ 9:30 am - September 14 @ 5:00 pm
    2. Semicon Europa

      November 14 - November 17
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