The WSM-100 is Takatori’s solution for temporary bonding of wafers up to 200mm using double sided tape. Choose heat release or UV release double sided tape to bond wafers in a quick, cost-effective process. Bonding occurs in a vacuum chamber to ensure the highest quality and eliminate bubbles.

  • Shows and Meeting Schedule

    1. CAMX 2017

      September 12 @ 9:30 am - September 14 @ 5:00 pm
    2. Semicon Europa

      November 14 - November 17
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