The WSM-100 is Takatori’s solution for temporary bonding of wafers up to 200mm using double sided tape. Choose heat release or UV release double sided tape to bond wafers in a quick, cost-effective process. Bonding occurs in a vacuum chamber to ensure the highest quality and eliminate bubbles.


  • Shows and Meeting Schedule

    1. SEMICON West 2018

      July 10 - July 12
    2. SEMICON Europa

      November 13 - November 16
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