A new diamond wire machine from Takatori, designed for slicing large blocks of hard materials from rounded ingots down to squared blocks.
Takatori’s largest standard wire saw, the MWS-812SD can be configured for diamond wire or slurry, and can cut workpieces up to 200mm / 8” in diameter and 300mm / 12” long. An even larger work envelope is possible for some applications.
Based on the popular MWS-612SD, this machine is designed for running diamond wire only, and is a popular choice for companies producing sapphire and other challenging materials.
The WSD-K2 is the first small-scale wire saw from Takatori. Designed for R&D and limited pilot production, the WSD-K2 uses diamond wire to slice workpieces up to 156mm in diameter using 1 to 10 wires. The machine is popular for diamond wire process development, and is used for materials like sapphire, SiC, glass, and more. The physics department at the University of California Santa Barbara use the WSD-K2 to slice bulk crystals of GaN grown by Nobel prize-winning physicist Shuji Nakamura.
The industry standard for slicing sapphire, the DN is a totally different design from Takatori. The new design allows wire speeds up to 1500 m/min, and reduces the number of pulleys for lower COO.