GTI Technologies
Semiconductor, Carbon Fiber, and Metalworking
The semi-automatic version of the VTM-300A, the “M” version is manually loaded and features the same lamination capabilities as the fully automatic machine. The VTM-300MA also adds the capability to mount wafers, making it a very flexible option.
The TUV-1 is a fully automatic tool for fast, efficient UV exposure of wafers up to 200mm.
The ATM-1100G is the standard Takatori laminator for wafers up to 200mm in diameter. Highly reliable, with high throughput and the flexibility to use almost any tape from any manufacturer.
The ATM-3000 is Takatori’s standard laminator for wafers up to 300mm. Achieve the highest quality lamination of BG tape with minimum tape tension and maximum reliability. The ATM-3000 is ready to be customized to your needs – add FOUP load ports, set the machine up to through-the-wall installation, and more.
The TEAM-100 is Takatori’s innovative solution to finding the highest quality wafer lamination. The TEAM-100 separates tape cutting from lamination, allowing a tape circle smaller than the wafer itself and protecting the wafer edge. The unique approach laminates the wafer inside a vacuum chamber with minimum pressure and zero tension, resulting in the highest quality lamination even on difficult wafers.