The TUV-1 is a fully automatic tool for fast, efficient UV exposure of wafers up to 200mm.
The GWSM-300M is a manually loaded version of the GWS-300. Bond wafers up to 300mm in a vacuum chamber.
DM-800 – Backside Lamination
A specialized lamination tool for backside lamination of single-layer die attach film (DAF) onto wafers up to 200mm. The machine is designed to safely handle wafers down to 50 microns, and to work with thin, delicate DAF tapes. Also available is the DM812, which will handle wafers up to 300mm.
The TEAM-100 is Takatori’s innovative solution to finding the highest quality wafer lamination. The TEAM-100 separates tape cutting from lamination, allowing a tape circle smaller than the wafer itself and protecting the wafer edge. The unique approach laminates the wafer inside a vacuum chamber with minimum pressure and zero tension, resulting in the highest quality lamination even on difficult wafers.
The ATM-12000 is a fully automatic frame mounter for 200mm and 300mm wafers.