The TUV-1 is a fully automatic tool for fast, efficient UV exposure of wafers up to 200mm.
The ATRM-2300 is the newest detaper for wafers up to 200mm from Takatori, the result of 25 years of experience handling the most challenging applications. The standard machine can handle wafers down to 150 microns, and is available with numerous options to meet your needs. Add UV capability, use special cassettes, add Bernoulli-type end-effectors, and more. Whatever your challenge – warped wafers, special tapes, double-slotted cassettes, the ATRM-2300 can handle it.
Also available in the ATRM-2300TK version, which is specially designed to safely detape the thinnest, most challenging TAIKO wafers.
The ATM-12000 is a fully automatic frame mounter for 200mm and 300mm wafers.
Package Mounting – ATM-9000 Series
Takatori also offers solutions for companies looking to mount rectangular package strips prior to dicing. Laminate with the highest quality in a vacuum chamber or maximize throughput with atmospheric lamination
The GWS is a fully automated solution for bonding wafers up to 300mm. Wafers are presented to the tool with adhesive already applied, and then wafers are bonded in a vacuum chamber for maximum quality.