TUV-1
The TUV-1 is a fully automatic tool for fast, efficient UV exposure of wafers up to 200mm.
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ATM-8200
Discover MoreThe standard wafer mounter from Takatori, the ATM-8200 has the smallest footprint for a 200mm mounter in the industry. The machine uses Takatori’s unique vacuum system to laminate in a vacuum chamber with minimal pressure, protecting delicate wafers.
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TEAM-100 – Backside Lamination
Discover MoreApply tapes to the backside of wafers, with or without frontside contact, using the TEAM-100. Tape is precut and applied in a vaccum chamber, minimizing lamination force and protecting the front side of the wafer. The unique TEAM-100 lamination method, which separates tape cutting from lamination, means that even Taiko wafers can be laminated on the backside.
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VTM-300MA
Discover MoreThe semi-automatic version of the VTM-300A, the “M” version is manually loaded and features the same lamination capabilities as the fully automatic machine. The VTM-300MA also adds the capability to mount wafers, making it a very flexible option.
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ATM-1100K
Discover MoreTakatori’s most advanced atmospheric laminator, the ATM-1100K features highly refined temperature and pressure controls to ensure high quality lamination of advanced films on wafers up to 200mm.
