TUV-1
The TUV-1 is a fully automatic tool for fast, efficient UV exposure of wafers up to 200mm.
Related products
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ATM-1100G
The ATM-1100G is the standard Takatori laminator for wafers up to 200mm in diameter. Highly reliable, with high throughput and the flexibility to use almost any tape from any manufacturer.
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Package Mounting – ATM-9000 Series
Takatori also offers solutions for companies looking to mount rectangular package strips prior to dicing. Laminate with the highest quality in a vacuum chamber or maximize throughput with atmospheric lamination
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ATM-8200
The standard wafer mounter from Takatori, the ATM-8200 has the smallest footprint for a 200mm mounter in the industry. The machine uses Takatori’s unique vacuum system to laminate in a vacuum chamber with minimal pressure, protecting delicate wafers.
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TEAM-100ARF
Laminate dry photoresist and other advanced films for wafer bumping, MEMS, TSVs, and other advanced packaging applications. The TEAM-100ARF laminates in the vacuum chamber for the highest quality and no micro-bubble, even around complex surface features. The machine also separates tape cutting from lamination, protecting the wafer edge and allowing a smaller diameter tape circle. For wafers up to 200mm.