The WSM-100 is Takatori’s solution for temporary bonding of wafers up to 200mm using double sided tape. Choose heat release or UV release double sided tape to bond wafers in a quick, cost-effective process. Bonding occurs in a vacuum chamber to ensure the highest quality and eliminate bubbles.
The semi-automatic version of the VTM-300A, the “M” version is manually loaded and features the same lamination capabilities as the fully automatic machine. The VTM-300MA also adds the capability to mount wafers, making it a very flexible option.
Apply tapes to the backside of wafers, with or without frontside contact, using the TEAM-100. Tape is precut and applied in a vaccum chamber, minimizing lamination force and protecting the front side of the wafer. The unique TEAM-100 lamination method, which separates tape cutting from lamination, means that even Taiko wafers can be laminated on the backside.
The ATRM-2300 is the newest detaper for wafers up to 200mm from Takatori, the result of 25 years of experience handling the most challenging applications. The standard machine can handle wafers down to 150 microns, and is available with numerous options to meet your needs. Add UV capability, use special cassettes, add Bernoulli-type end-effectors, and more. Whatever your challenge – warped wafers, special tapes, double-slotted cassettes, the ATRM-2300 can handle it.
Also available in the ATRM-2300TK version, which is specially designed to safely detape the thinnest, most challenging TAIKO wafers.