Apply tapes to the backside of wafers, with or without frontside contact, using the TEAM-100. Tape is precut and applied in a vaccum chamber, minimizing lamination force and protecting the front side of the wafer. The unique TEAM-100 lamination method, which separates tape cutting from lamination, means that even Taiko wafers can be laminated on the backside.
The WSM-200 is a de-bonding and mounting solution for wafers up to 200mm. The machine first mounts wafers on a dicing frame using Takatori’s vacuum bonding technology, and then removes the carrier wafer using either heat or UV exposure (depending on the adhesive type).
The TEAM-100 is Takatori’s innovative solution to finding the highest quality wafer lamination. The TEAM-100 separates tape cutting from lamination, allowing a tape circle smaller than the wafer itself and protecting the wafer edge. The unique approach laminates the wafer inside a vacuum chamber with minimum pressure and zero tension, resulting in the highest quality lamination even on difficult wafers.
The ATRM-2300 is the newest detaper for wafers up to 200mm from Takatori, the result of 25 years of experience handling the most challenging applications. The standard machine can handle wafers down to 150 microns, and is available with numerous options to meet your needs. Add UV capability, use special cassettes, add Bernoulli-type end-effectors, and more. Whatever your challenge – warped wafers, special tapes, double-slotted cassettes, the ATRM-2300 can handle it.
Also available in the ATRM-2300TK version, which is specially designed to safely detape the thinnest, most challenging TAIKO wafers.