Laminate dry photoresist and other advanced films for wafer bumping, MEMS, TSVs, and other advanced packaging applications. The TEAM-300ARF laminates in the vacuum chamber for the highest quality and no micro-bubble, even around complex surface features. The machine also separates tape cutting from lamination, protecting the wafer edge and allowing a smaller diameter tape circle. For wafers up to 300mm.

  • Shows and Meeting Schedule

    1. CAMX 2018 – Dallas

      October 15 - October 18
    2. SEMICON Europa

      November 13 - November 16
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