For some applications it is safest to keep BG on each wafer until after mounting onto a dicing frame. The TEAM-200 is designed to automatically remove BG from mounted wafers, handling wafers down to 50 microns in thickness and up to 200mm in size.

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    1. NEPCON – 2018 – R&D and Manufacturing

      January 17, 2018 @ 10:00 am - January 19, 2018 @ 5:00 pm
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