Laminate dry photoresist and other advanced films for wafer bumping, MEMS, TSVs, and other advanced packaging applications. The TEAM-100ARF laminates in the vacuum chamber for the highest quality and no micro-bubble, even around complex surface features. The machine also separates tape cutting from lamination, protecting the wafer edge and allowing a smaller diameter tape circle. For wafers up to 200mm.

  • Shows and Meeting Schedule

    1. CS International – 2018

      April 10 - April 11
    2. SEMICON West 2018

      July 10 - July 12
    3. SEMICON Europa

      November 13 - November 16
  • Contact GTI