Laminate dry photoresist and other advanced films for wafer bumping, MEMS, TSVs, and other advanced packaging applications. The TEAM-100ARF laminates in the vacuum chamber for the highest quality and no micro-bubble, even around complex surface features. The machine also separates tape cutting from lamination, protecting the wafer edge and allowing a smaller diameter tape circle. For wafers up to 200mm.


  • Shows and Meeting Schedule

    1. CAMX 2017

      September 12 @ 9:30 am - September 14 @ 5:00 pm
    2. Semicon Europa

      November 14 - November 17
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