The TEAM-100 is Takatori’s innovative solution to finding the highest quality wafer lamination. The TEAM-100 separates tape cutting from lamination, allowing a tape circle smaller than the wafer itself and protecting the wafer edge. The unique approach laminates the wafer inside a vacuum chamber with minimum pressure and zero tension, resulting in the highest quality lamination even on difficult wafers.

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  • Shows and Meeting Schedule

    1. CS International – 2018

      April 10 - April 11
    2. SEMICON West 2018

      July 10 - July 12
    3. SEMICON Europa

      November 13 - November 16
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