Apply tapes to the backside of wafers, with or without frontside contact, using the TEAM-100. Tape is precut and applied in a vaccum chamber, minimizing lamination force and protecting the front side of the wafer. The unique TEAM-100 lamination method, which separates tape cutting from lamination, means that even Taiko wafers can be laminated on the backside.


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    1. CAMX 2017

      September 12 @ 9:30 am - September 14 @ 5:00 pm
    2. Semicon Europa

      November 14 - November 17
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