Apply tapes to the backside of wafers, with or without frontside contact, using the TEAM-100. Tape is precut and applied in a vaccum chamber, minimizing lamination force and protecting the front side of the wafer. The unique TEAM-100 lamination method, which separates tape cutting from lamination, means that even Taiko wafers can be laminated on the backside.


  • Shows and Meeting Schedule

    1. European Conference on SiC and Related Materials

      September 2 - September 6
    2. IMTS 2018

      September 10 - September 15
    3. CAMX 2018 – Dallas

      October 15 - October 18
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