Apply tapes to the backside of wafers, with or without frontside contact, using the TEAM-100. Tape is precut and applied in a vaccum chamber, minimizing lamination force and protecting the front side of the wafer. The unique TEAM-100 lamination method, which separates tape cutting from lamination, means that even Taiko wafers can be laminated on the backside.


  • Shows and Meeting Schedule

    1. NEPCON – 2018 – R&D and Manufacturing

      January 17, 2018 @ 10:00 am - January 19, 2018 @ 5:00 pm
  • Contact GTI