GTI Technologies
Semiconductor, Carbon Fiber, and Metalworking
Takatori has developed a specialized tool for remounting wafers – in some processes, mounted wafers need to be moved from one frame or expansion ring to a new frame.
The ATM-12000 is a fully automatic frame mounter for 200mm and 300mm wafers.
The ATM-3000 is Takatori’s standard laminator for wafers up to 300mm. Achieve the highest quality lamination of BG tape with minimum tape tension and maximum reliability. The ATM-3000 is ready to be customized to your needs – add FOUP load ports, set the machine up to through-the-wall installation, and more.
The ATM-1100G is the standard Takatori laminator for wafers up to 200mm in diameter. Highly reliable, with high throughput and the flexibility to use almost any tape from any manufacturer.
Laminate dry photoresist and other advanced films for wafer bumping, MEMS, TSVs, and other advanced packaging applications. The TEAM-300ARF laminates in the vacuum chamber for the highest quality and no micro-bubble, even around complex surface features. The machine also separates tape cutting from lamination, protecting the wafer edge and allowing a smaller diameter tape circle. For wafers up to 300mm.
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