Remounting
Takatori has developed a specialized tool for remounting wafers – in some processes, mounted wafers need to be moved from one frame or expansion ring to a new frame.
Related products
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ATM-12000
Discover MoreThe ATM-12000 is a fully automatic frame mounter for 200mm and 300mm wafers.
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ATM-3000
Discover MoreThe ATM-3000 is Takatori’s standard laminator for wafers up to 300mm. Achieve the highest quality lamination of BG tape with minimum tape tension and maximum reliability. The ATM-3000 is ready to be customized to your needs – add FOUP load ports, set the machine up to through-the-wall installation, and more.
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ATM-8100SR
Discover MoreThe ATM-8100 continues to be the basis for Takatori’s multi-role machines. The ATM-8100SR can be configured to integrate de-mounting of bonded wafers, or can include removal of BG tape (including UV tapes).
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DM-800 – Backside Lamination
Discover MoreA specialized lamination tool for backside lamination of single-layer die attach film (DAF) onto wafers up to 200mm. The machine is designed to safely handle wafers down to 50 microns, and to work with thin, delicate DAF tapes. Also available is the DM812, which will handle wafers up to 300mm.
