Remounting
Takatori has developed a specialized tool for remounting wafers – in some processes, mounted wafers need to be moved from one frame or expansion ring to a new frame.
Related products
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ATM-8100SR
The ATM-8100 continues to be the basis for Takatori’s multi-role machines. The ATM-8100SR can be configured to integrate de-mounting of bonded wafers, or can include removal of BG tape (including UV tapes). -
ATM-1100K
Takatori’s most advanced atmospheric laminator, the ATM-1100K features highly refined temperature and pressure controls to ensure high quality lamination of advanced films on wafers up to 200mm. -
WSM-100
The WSM-100 is Takatori’s solution for temporary bonding of wafers up to 200mm using double sided tape. Choose heat release or UV release double sided tape to bond wafers in a quick, cost-effective process. Bonding occurs in a vacuum chamber to ensure the highest quality and eliminate bubbles.
