Package Mounting – ATM-9000 Series
Takatori also offers solutions for companies looking to mount rectangular package strips prior to dicing. Laminate with the highest quality in a vacuum chamber or maximize throughput with atmospheric lamination
Related products
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TEAM-100
The TEAM-100 is Takatori’s innovative solution to finding the highest quality wafer lamination. The TEAM-100 separates tape cutting from lamination, allowing a tape circle smaller than the wafer itself and protecting the wafer edge. The unique approach laminates the wafer inside a vacuum chamber with minimum pressure and zero tension, resulting in the highest quality lamination even on difficult wafers. -
ATM-1100G
The ATM-1100G is the standard Takatori laminator for wafers up to 200mm in diameter. Highly reliable, with high throughput and the flexibility to use almost any tape from any manufacturer. -
GWSM-300M
The GWSM-300M is a manually loaded version of the GWS-300. Bond wafers up to 300mm in a vacuum chamber.
