GTI Technologies
Semiconductor, Carbon Fiber, and Metalworking
Takatori’s largest standard wire saw, the MWS-812SD can be configured for diamond wire or slurry, and can cut workpieces up to 200mm / 8” in diameter and 300mm / 12” long. An even larger work envelope is possible for some applications.
A new diamond wire machine from Takatori, designed for slicing large blocks of hard materials from rounded ingots down to squared blocks.
The WSD-K2 is the first small-scale wire saw from Takatori. Designed for R&D and limited pilot production, the WSD-K2 uses diamond wire to slice workpieces up to 156mm in diameter using 1 to 10 wires. The machine is popular for diamond wire process development, and is used for materials like sapphire, SiC, glass, and more. The physics department at the University of California Santa Barbara use the WSD-K2 to slice bulk crystals of GaN grown by Nobel prize-winning physicist Shuji Nakamura.
The latest generation of the original Takatori wire saw, the MWS-34SN brings multi-wire slicing to smaller diameter materials up to 3” / 80mm in diameter and 4” / 105mm in length. Compact in size and quiet in operation, the MWS-34SN features a simple two-spindle design, Takatori’s unique rocking system, and an advanced servo-controlled tensioning system.
The “big brother” of the WSD-K2, increasing the maximum workpiece diameter to 200mm.