GTI Technologies
Semiconductor, Carbon Fiber, and Metalworking
Based on the popular MWS-612SD, this machine is designed for running diamond wire only, and is a popular choice for companies producing sapphire and other challenging materials.
The industry standard for slicing sapphire, the DN is a totally different design from Takatori. The new design allows wire speeds up to 1500 m/min, and reduces the number of pulleys for lower COO.
A new diamond wire machine from Takatori, designed for slicing large blocks of hard materials from rounded ingots down to squared blocks.
The standard down-cut multi wire saw from Takatori, the MWS-610SD has a maximum slicing diameter of 6”/150mm and a work length of 10”/270mm. The machine uses three work rollers, allowing larger pitches, and features Takatori’s unique rocking system and auto-winding. A rock-solid, industry proven machine for almost any material.
The WSD-K2 is the first small-scale wire saw from Takatori. Designed for R&D and limited pilot production, the WSD-K2 uses diamond wire to slice workpieces up to 156mm in diameter using 1 to 10 wires. The machine is popular for diamond wire process development, and is used for materials like sapphire, SiC, glass, and more. The physics department at the University of California Santa Barbara use the WSD-K2 to slice bulk crystals of GaN grown by Nobel prize-winning physicist Shuji Nakamura.
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