Name: Semicon Europa
Start: 2017-11-13T23:00:00+00:00
End: 2017-11-17T22:59:59+00:00

The GWSM-300M is a manually loaded version of the GWS-300. Bond wafers up to 300mm in a vacuum chamber.

Related products

ATRM-2300
The ATRM-2300 is the newest detaper for wafers up to 200mm from Takatori, the result of 25 years of experience handling the most challenging applications. The standard machine can handle wafers down to 150 microns, and is available with numerous options to meet your needs. Add UV capability, use special cassettes, add Bernoulli-type end-effectors, and more. Whatever your challenge – warped wafers, special tapes, double-slotted cassettes, the ATRM-2300 can handle it. Also available in the ATRM-2300TK version, which is specially designed to safely detape the thinnest, most challenging TAIKO wafers.
Discover More
Get a Quote
ATM-12000
The ATM-12000 is a fully automatic frame mounter for 200mm and 300mm wafers.
Discover More
Get a Quote
WSM-100
The WSM-100 is Takatori’s solution for temporary bonding of wafers up to 200mm using double sided tape. Choose heat release or UV release double sided tape to bond wafers in a quick, cost-effective process. Bonding occurs in a vacuum chamber to ensure the highest quality and eliminate bubbles.
Discover More
Get a Quote
ATM-3000
The ATM-3000 is Takatori’s standard laminator for wafers up to 300mm. Achieve the highest quality lamination of BG tape with minimum tape tension and maximum reliability. The ATM-3000 is ready to be customized to your needs – add FOUP load ports, set the machine up to through-the-wall installation, and more.
Discover More
Get a Quote

GWSM-300M