Takatori’s most capable, flexible laminator, the VTS series machines are capable of different types of lamination, including vacuum. The machine can be used to laminate different types of films, including dry film and non-conductive films (NCF). Suitable for wafers up to 300mm.
Apply tapes to the backside of wafers, with or without frontside contact, using the TEAM-100. Tape is precut and applied in a vaccum chamber, minimizing lamination force and protecting the front side of the wafer. The unique TEAM-100 lamination method, which separates tape cutting from lamination, means that even Taiko wafers can be laminated on the backside.
Taiko wafers present a unique challenge, but are even the thinnest wafers are suitable for the ATM-8100TK, the industry standard for mounting Taiko wafers. Safely mount with the highest quality, without voids or bubbles.