GWSM-300M
The GWSM-300M is a manually loaded version of the GWS-300. Bond wafers up to 300mm in a vacuum chamber.
Related products
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DM-800 – Backside Lamination
A specialized lamination tool for backside lamination of single-layer die attach film (DAF) onto wafers up to 200mm. The machine is designed to safely handle wafers down to 50 microns, and to work with thin, delicate DAF tapes. Also available is the DM812, which will handle wafers up to 300mm. -
Remounting
Takatori has developed a specialized tool for remounting wafers – in some processes, mounted wafers need to be moved from one frame or expansion ring to a new frame.
