GWSM-300M
The GWSM-300M is a manually loaded version of the GWS-300. Bond wafers up to 300mm in a vacuum chamber.
Related products
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Remounting
Takatori has developed a specialized tool for remounting wafers – in some processes, mounted wafers need to be moved from one frame or expansion ring to a new frame.
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TEAM-100 – Backside Lamination
Apply tapes to the backside of wafers, with or without frontside contact, using the TEAM-100. Tape is precut and applied in a vaccum chamber, minimizing lamination force and protecting the front side of the wafer. The unique TEAM-100 lamination method, which separates tape cutting from lamination, means that even Taiko wafers can be laminated on the backside.
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AMR-2200G
Remove excess gold or other metals from a wafer’s surface using a simple, effective, tape-based process. No solvents or other chemistry required, and the often valuable metals can be more easily reclaimed from the waste tape. Save money and time by maximizing reclaim and reducing costs by eliminating chemical handling and disposal.
Machine Basics –
Wafer Sizes – 100mm, 150mm, 200mm
Throughput – Up to 40 wph, application dependent
Machine size – 1100mm x 930mm x 1645mm (W x L x H) -
WSM-100
The WSM-100 is Takatori’s solution for temporary bonding of wafers up to 200mm using double sided tape. Choose heat release or UV release double sided tape to bond wafers in a quick, cost-effective process. Bonding occurs in a vacuum chamber to ensure the highest quality and eliminate bubbles.