GWS-300
The GWS is a fully automated solution for bonding wafers up to 300mm. Wafers are presented to the tool with adhesive already applied, and then wafers are bonded in a vacuum chamber for maximum quality.
Related products
-
TEAM-100
Discover MoreThe TEAM-100 is Takatori’s innovative solution to finding the highest quality wafer lamination. The TEAM-100 separates tape cutting from lamination, allowing a tape circle smaller than the wafer itself and protecting the wafer edge. The unique approach laminates the wafer inside a vacuum chamber with minimum pressure and zero tension, resulting in the highest quality lamination even on difficult wafers.
-
ATM-12000
Discover MoreThe ATM-12000 is a fully automatic frame mounter for 200mm and 300mm wafers.
-
ATM-8100TK
Discover MoreTaiko wafers present a unique challenge, but are even the thinnest wafers are suitable for the ATM-8100TK, the industry standard for mounting Taiko wafers. Safely mount with the highest quality, without voids or bubbles.
-
ATM-1100G
Discover MoreThe ATM-1100G is the standard Takatori laminator for wafers up to 200mm in diameter. Highly reliable, with high throughput and the flexibility to use almost any tape from any manufacturer.
