The GWS is a fully automated solution for bonding wafers up to 300mm. Wafers are presented to the tool with adhesive already applied, and then wafers are bonded in a vacuum chamber for maximum quality.


  • Shows and Meeting Schedule

    1. CAMX 2018 – Dallas

      October 15 - October 18
    2. SEMICON Europa

      November 13 - November 16
  • Contact GTI