The GWS is a fully automated solution for bonding wafers up to 300mm. Wafers are presented to the tool with adhesive already applied, and then wafers are bonded in a vacuum chamber for maximum quality.

  • Shows and Meeting Schedule

    1. SEMICON West 2018

      July 10 - July 12
    2. SEMICON Europa

      November 13 - November 16
  • Contact GTI