The GWS is a fully automated solution for bonding wafers up to 300mm. Wafers are presented to the tool with adhesive already applied, and then wafers are bonded in a vacuum chamber for maximum quality.


  • Shows and Meeting Schedule

    1. NEPCON – 2018 – R&D and Manufacturing

      January 17, 2018 @ 10:00 am - January 19, 2018 @ 5:00 pm
  • Contact GTI