GWS-300
The GWS is a fully automated solution for bonding wafers up to 300mm. Wafers are presented to the tool with adhesive already applied, and then wafers are bonded in a vacuum chamber for maximum quality.
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AMR-2200G
Discover MoreRemove excess gold or other metals from a wafer’s surface using a simple, effective, tape-based process. No solvents or other chemistry required, and the often valuable metals can be more easily reclaimed from the waste tape. Save money and time by maximizing reclaim and reducing costs by eliminating chemical handling and disposal.
Machine Basics –
Wafer Sizes – 100mm, 150mm, 200mm
Throughput – Up to 40 wph, application dependent
Machine size – 1100mm x 930mm x 1645mm (W x L x H) -
ATM-12000
Discover MoreThe ATM-12000 is a fully automatic frame mounter for 200mm and 300mm wafers.
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ATM-1100K
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VTM-300A
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