A specialized lamination tool for backside lamination of single-layer die attach film (DAF) onto wafers up to 200mm. The machine is designed to safely handle wafers down to 50 microns, and to work with thin, delicate DAF tapes. Also available is the DM812, which will handle wafers up to 300mm.


  • Shows and Meeting Schedule

    1. European Conference on SiC and Related Materials

      September 2 - September 6
    2. IMTS 2018

      September 10 - September 15
    3. CAMX 2018 – Dallas

      October 15 - October 18
  • Contact GTI