Takatori has delivered dozens of machines for processing Taiko wafers, including the ATRM-2300TK, the most advanced detaper on the market. The machine uses specialized handling to deal with ultra-thin, heavily warped wafers safely, and can removed standard or UV tape. Achieve removal with full backside support (adjustable for different step heights) or contact only the Taiko ring and still safely detape even the thinnest wafers.

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  • Shows and Meeting Schedule

    1. European Conference on SiC and Related Materials

      September 2 - September 6
    2. IMTS 2018

      September 10 - September 15
    3. CAMX 2018 – Dallas

      October 15 - October 18
  • Contact GTI