Takatori has delivered dozens of machines for processing Taiko wafers, including the ATRM-2300TK, the most advanced detaper on the market. The machine uses specialized handling to deal with ultra-thin, heavily warped wafers safely, and can removed standard or UV tape. Achieve removal with full backside support (adjustable for different step heights) or contact only the Taiko ring and still safely detape even the thinnest wafers.


  • Shows and Meeting Schedule

    1. CS International – 2018

      April 10 - April 11
    2. SEMICON West 2018

      July 10 - July 12
    3. SEMICON Europa

      November 13 - November 16
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