The ATRM-2300 is the newest detaper for wafers up to 200mm from Takatori, the result of 25 years of experience handling the most challenging applications. The standard machine can handle wafers down to 150 microns, and is available with numerous options to meet your needs. Add UV capability, use special cassettes, add Bernoulli-type end-effectors, and more. Whatever your challenge – warped wafers, special tapes, double-slotted cassettes, the ATRM-2300 can handle it.

Also available in the ATRM-2300TK version, which is specially designed to safely detape the thinnest, most challenging TAIKO wafers.

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  • Shows and Meeting Schedule

    1. European Conference on SiC and Related Materials

      September 2 - September 6
    2. IMTS 2018

      September 10 - September 15
    3. CAMX 2018 – Dallas

      October 15 - October 18
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