ATM-8100SR
The ATM-8100 continues to be the basis for Takatori’s multi-role machines. The ATM-8100SR can be configured to integrate de-mounting of bonded wafers, or can include removal of BG tape (including UV tapes).
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TEAM-300ARF
Discover MoreLaminate dry photoresist and other advanced films for wafer bumping, MEMS, TSVs, and other advanced packaging applications. The TEAM-300ARF laminates in the vacuum chamber for the highest quality and no micro-bubble, even around complex surface features. The machine also separates tape cutting from lamination, protecting the wafer edge and allowing a smaller diameter tape circle. For wafers up to 300mm.
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ATM-12000DR
Discover MoreThe ATM-12000DR is based on the ATM-12000, but includes an integrated post-mounting de-tape function to facilitate processing of thin wafers.
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VTM-300MA
Discover MoreThe semi-automatic version of the VTM-300A, the “M” version is manually loaded and features the same lamination capabilities as the fully automatic machine. The VTM-300MA also adds the capability to mount wafers, making it a very flexible option.
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VTM-300A
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