The ATM-8100 continues to be the basis for Takatori’s multi-role machines. The ATM-8100SR can be configured to integrate de-mounting of bonded wafers, or can include removal of BG tape (including UV tapes).
Takatori also offers solutions for companies looking to mount rectangular package strips prior to dicing. Laminate with the highest quality in a vacuum chamber or maximize throughput with atmospheric lamination
Lift excess gold or other metals from a wafer’s surface using a simple, effective, tape-based process. No solvents or other chemistry required, and the often valuable metals can be more easily reclaimed from the waste tape.
The ATM-3000 is Takatori’s standard laminator for wafers up to 300mm. Achieve the highest quality lamination of BG tape with minimum tape tension and maximum reliability. The ATM-3000 is ready to be customized to your needs – add FOUP load ports, set the machine up to through-the-wall installation, and more.