The ATM-12000 is a fully automatic frame mounter for 200mm and 300mm wafers.
The TUV-1 is a fully automatic tool for fast, efficient UV exposure of wafers up to 200mm.
The ATM-12000DR is based on the ATM-12000, but includes an integrated post-mounting de-tape function to facilitate processing of thin wafers.
TEAM-100 – Backside Lamination
Apply tapes to the backside of wafers, with or without frontside contact, using the TEAM-100. Tape is precut and applied in a vaccum chamber, minimizing lamination force and protecting the front side of the wafer. The unique TEAM-100 lamination method, which separates tape cutting from lamination, means that even Taiko wafers can be laminated on the backside.