The GWS is a fully automated solution for bonding wafers up to 300mm. Wafers are presented to the tool with adhesive already applied, and then wafers are bonded in a vacuum chamber for maximum quality.
Takatori also offers solutions for companies looking to mount rectangular package strips prior to dicing. Laminate with the highest quality in a vacuum chamber or maximize throughput with atmospheric lamination
Laminate dry photoresist and other advanced films for wafer bumping, MEMS, TSVs, and other advanced packaging applications. The TEAM-300ARF laminates in the vacuum chamber for the highest quality and no micro-bubble, even around complex surface features. The machine also separates tape cutting from lamination, protecting the wafer edge and allowing a smaller diameter tape circle. For wafers up to 300mm.