Lift excess gold or other metals from a wafer’s surface using a simple, effective, tape-based process. No solvents or other chemistry required, and the often valuable metals can be more easily reclaimed from the waste tape.
The WSM-200 is a de-bonding and mounting solution for wafers up to 200mm. The machine first mounts wafers on a dicing frame using Takatori’s vacuum bonding technology, and then removes the carrier wafer using either heat or UV exposure (depending on the adhesive type).
The standard wafer mounter from Takatori, the ATM-8200 has the smallest footprint for a 200mm mounter in the industry. The machine uses Takatori’s unique vacuum system to laminate in a vacuum chamber with minimal pressure, protecting delicate wafers.