The ATM-12000 is a fully automatic frame mounter for 200mm and 300mm wafers.
The ATM-1100G is the standard Takatori laminator for wafers up to 200mm in diameter. Highly reliable, with high throughput and the flexibility to use almost any tape from any manufacturer.
DM-800 – Backside Lamination
A specialized lamination tool for backside lamination of single-layer die attach film (DAF) onto wafers up to 200mm. The machine is designed to safely handle wafers down to 50 microns, and to work with thin, delicate DAF tapes. Also available is the DM812, which will handle wafers up to 300mm.
The ATM-8100 continues to be the basis for Takatori’s multi-role machines. The ATM-8100SR can be configured to integrate de-mounting of bonded wafers, or can include removal of BG tape (including UV tapes).
The TUV-1 is a fully automatic tool for fast, efficient UV exposure of wafers up to 200mm.