The ATM-12000 is a fully automatic frame mounter for 200mm and 300mm wafers.
DM-800 – Backside Lamination
A specialized lamination tool for backside lamination of single-layer die attach film (DAF) onto wafers up to 200mm. The machine is designed to safely handle wafers down to 50 microns, and to work with thin, delicate DAF tapes. Also available is the DM812, which will handle wafers up to 300mm.
The GWS is a fully automated solution for bonding wafers up to 300mm. Wafers are presented to the tool with adhesive already applied, and then wafers are bonded in a vacuum chamber for maximum quality.
Takatori’s most advanced atmospheric laminator, the ATM-1100K features highly refined temperature and pressure controls to ensure high quality lamination of advanced films on wafers up to 200mm.
The semi-automatic version of the VTM-300A, the “M” version is manually loaded and features the same lamination capabilities as the fully automatic machine. The VTM-300MA also adds the capability to mount wafers, making it a very flexible option.