The ATM-12000 is a fully automatic frame mounter for 200mm and 300mm wafers.
The ATM-1100G is the standard Takatori laminator for wafers up to 200mm in diameter. Highly reliable, with high throughput and the flexibility to use almost any tape from any manufacturer.
The ATM-12000DR is based on the ATM-12000, but includes an integrated post-mounting de-tape function to facilitate processing of thin wafers.
Laminate dry photoresist and other advanced films for wafer bumping, MEMS, TSVs, and other advanced packaging applications. The TEAM-300ARF laminates in the vacuum chamber for the highest quality and no micro-bubble, even around complex surface features. The machine also separates tape cutting from lamination, protecting the wafer edge and allowing a smaller diameter tape circle. For wafers up to 300mm.
Takatori’s most advanced atmospheric laminator, the ATM-1100K features highly refined temperature and pressure controls to ensure high quality lamination of advanced films on wafers up to 200mm.