The WSM-100 is Takatori’s solution for temporary bonding of wafers up to 200mm using double sided tape. Choose heat release or UV release double sided tape to bond wafers in a quick, cost-effective process. Bonding occurs in a vacuum chamber to ensure the highest quality and eliminate bubbles.
Taiko wafers present a unique challenge, but are even the thinnest wafers are suitable for the ATM-8100TK, the industry standard for mounting Taiko wafers. Safely mount with the highest quality, without voids or bubbles.
Laminate dry photoresist and other advanced films for wafer bumping, MEMS, TSVs, and other advanced packaging applications. The TEAM-100ARF laminates in the vacuum chamber for the highest quality and no micro-bubble, even around complex surface features. The machine also separates tape cutting from lamination, protecting the wafer edge and allowing a smaller diameter tape circle. For wafers up to 200mm.
Takatori’s most capable, flexible laminator, the VTS series machines are capable of different types of lamination, including vacuum. The machine can be used to laminate different types of films, including dry film and non-conductive films (NCF). Suitable for wafers up to 300mm.