ATM-1100K
Takatori’s most advanced atmospheric laminator, the ATM-1100K features highly refined temperature and pressure controls to ensure high quality lamination of advanced films on wafers up to 200mm.
Related products
-
WSM-200
Discover MoreThe WSM-200 is a de-bonding and mounting solution for wafers up to 200mm. The machine first mounts wafers on a dicing frame using Takatori’s vacuum bonding technology, and then removes the carrier wafer using either heat or UV exposure (depending on the adhesive type).
-
Remounting
Discover MoreTakatori has developed a specialized tool for remounting wafers – in some processes, mounted wafers need to be moved from one frame or expansion ring to a new frame.
-
AMR-2200G
Discover MoreRemove excess gold or other metals from a wafer’s surface using a simple, effective, tape-based process. No solvents or other chemistry required, and the often valuable metals can be more easily reclaimed from the waste tape. Save money and time by maximizing reclaim and reducing costs by eliminating chemical handling and disposal.
Machine Basics –
Wafer Sizes – 100mm, 150mm, 200mm
Throughput – Up to 40 wph, application dependent
Machine size – 1100mm x 930mm x 1645mm (W x L x H) -
DM-800 – Backside Lamination
Discover MoreA specialized lamination tool for backside lamination of single-layer die attach film (DAF) onto wafers up to 200mm. The machine is designed to safely handle wafers down to 50 microns, and to work with thin, delicate DAF tapes. Also available is the DM812, which will handle wafers up to 300mm.
