Remove excess gold or other metals from a wafer’s surface using a simple, effective, tape-based process. No solvents or other chemistry required, and the often valuable metals can be more easily reclaimed from the waste tape. Save money and time by maximizing reclaim and reducing costs by eliminating chemical handling and disposal.
Machine Basics –
Wafer Sizes – 100mm, 150mm, 200mm
Throughput – Up to 40 wph, application dependent
Machine size – 1100mm x 930mm x 1645mm (W x L x H)