Lift excess gold or other metals from a wafer’s surface using a simple, effective, tape-based process. No solvents or other chemistry required, and the often valuable metals can be more easily reclaimed from the waste tape.


  • Shows and Meeting Schedule

    1. European Conference on SiC and Related Materials

      September 2 - September 6
    2. IMTS 2018

      September 10 - September 15
    3. CAMX 2018 – Dallas

      October 15 - October 18
  • Contact GTI