Lift excess gold or other metals from a wafer’s surface using a simple, effective, tape-based process. No solvents or other chemistry required, and the often valuable metals can be more easily reclaimed from the waste tape.
Takatori also offers solutions for companies looking to mount rectangular package strips prior to dicing. Laminate with the highest quality in a vacuum chamber or maximize throughput with atmospheric lamination
The standard wafer mounter from Takatori, the ATM-8200 has the smallest footprint for a 200mm mounter in the industry. The machine uses Takatori’s unique vacuum system to laminate in a vacuum chamber with minimal pressure, protecting delicate wafers.
The GWS is a fully automated solution for bonding wafers up to 300mm. Wafers are presented to the tool with adhesive already applied, and then wafers are bonded in a vacuum chamber for maximum quality.
Takatori’s most capable, flexible laminator, the VTS series machines are capable of different types of lamination, including vacuum. The machine can be used to laminate different types of films, including dry film and non-conductive films (NCF). Suitable for wafers up to 300mm.