Lift excess gold or other metals from a wafer’s surface using a simple, effective, tape-based process. No solvents or other chemistry required, and the often valuable metals can be more easily reclaimed from the waste tape.
The WSM-200 is a de-bonding and mounting solution for wafers up to 200mm. The machine first mounts wafers on a dicing frame using Takatori’s vacuum bonding technology, and then removes the carrier wafer using either heat or UV exposure (depending on the adhesive type).
A specialized lamination tool for backside lamination of single-layer die attach film (DAF) onto wafers up to 200mm. The machine is designed to safely handle wafers down to 50 microns, and to work with thin, delicate DAF tapes. Also available is the DM812, which will handle wafers up to 300mm.
The ATM-8100 continues to be the basis for Takatori’s multi-role machines. The ATM-8100SR can be configured to integrate de-mounting of bonded wafers, or can include removal of BG tape (including UV tapes).