Semiconductor
Showing 13–16 of 23 results
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Package Mounting – ATM-9000 Series
Discover MoreTakatori also offers solutions for companies looking to mount rectangular package strips prior to dicing. Laminate with the highest quality in a vacuum chamber or maximize throughput with atmospheric lamination
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Remounting
Discover MoreTakatori has developed a specialized tool for remounting wafers – in some processes, mounted wafers need to be moved from one frame or expansion ring to a new frame.
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TEAM-100
Discover MoreThe TEAM-100 is Takatori’s innovative solution to finding the highest quality wafer lamination. The TEAM-100 separates tape cutting from lamination, allowing a tape circle smaller than the wafer itself and protecting the wafer edge. The unique approach laminates the wafer inside a vacuum chamber with minimum pressure and zero tension, resulting in the highest quality lamination even on difficult wafers.
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TEAM-100 – Backside Lamination
Discover MoreApply tapes to the backside of wafers, with or without frontside contact, using the TEAM-100. Tape is precut and applied in a vaccum chamber, minimizing lamination force and protecting the front side of the wafer. The unique TEAM-100 lamination method, which separates tape cutting from lamination, means that even Taiko wafers can be laminated on the backside.
