Tape / Detape / Mount
Takatori produces a full line of equipment for protective tape lamination prior to back grinding, tape removal, and mounting onto dicing frames. Ready for the most demanding thin-wafer application, including Taiko wafers, Takatori has been producing tape, detape, and mounting equipment for over 25 years.
Laminators 3Takatori offers a complete line of BG tape laminators. Fast, dependable, and able to laminate any tape from any manufacturer, Takatori laminators are workhorse machines designed for years of high-volume production. Standard machines like the ATM-1100G are used in fabs all over the world for typical applications.
Detapers 4As the demand for thinner and thinner wafers has progressed, Takatori has advanced their capability to provide safe handling and tape removal on even the thinnest wafers. We have a proven track record on even the most challenging application, including special tapes, Taiko wafers, non-contact handling, and more.
Wafer Mounters 7From the beginning, Takatori has used their unique vacuum lamination technology to mount wafers, ensuring the highest quality lamination with minimum force and no micro-bubbles. They have an incredibly flexible line of mounting machines, and can meet any need. Use any dicing tape (continuous or pre-cut), double layer DAF, integrate demounting from a wafer carrier,…