Tape / Detape / Mount

Takatori produces a full line of equipment for protective tape lamination prior to back grinding, tape removal, and mounting onto dicing frames. Ready for the most demanding thin-wafer application, including Taiko wafers, Takatori has been producing tape, detape, and mounting equipment for over 25 years.

Laminators 3

Takatori offers a complete line of BG tape laminators. Fast, dependable, and able to laminate any tape from any manufacturer, Takatori laminators are workhorse machines designed for years of high-volume production. Standard machines like the ATM-1100G are used in fabs all over the world for typical applications.
Detapers 4

As the demand for thinner and thinner wafers has progressed, Takatori has advanced their capability to provide safe handling and tape removal on even the thinnest wafers. We have a proven track record on even the most challenging application, including special tapes, Taiko wafers, non-contact handling, and more.
Wafer Mounters 7

From the beginning, Takatori has used their unique vacuum lamination technology to mount wafers, ensuring the highest quality lamination with minimum force and no micro-bubbles. They have an incredibly flexible line of mounting machines, and can meet any need. Use any dicing tape (continuous or pre-cut), double layer DAF, integrate demounting from a wafer carrier,…