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Takatori’s most advanced atmospheric laminator, the ATM-1100K features highly refined temperature and pressure controls to ensure high quality lamination of advanced films on wafers up to 200mm.
DM-800 – Backside Lamination
A specialized lamination tool for backside lamination of single-layer die attach film (DAF) onto wafers up to 200mm. The machine is designed to safely handle wafers down to 50 microns, and to work with thin, delicate DAF tapes. Also available is the DM812, which will handle wafers up to 300mm.