For 25 years Takatori has been delivering machines to the semiconductor industry. Their core application is protective tape lamination prior to backgrinding, along with tape removal after grinding and wafer mounting. In this area Takatori can provide solutions for the most demanding thin-wafer applications, including Taiko.
Takatori has taken their decades-long expertise in this area and expanded to the lamination of advanced films including dry film, DAF, and NCF. They also offer specialized equipment for wafer bonding, UV exposure, and metal lift-off.
Takatori produces a full line of equipment for protective tape lamination prior to back grinding, tape removal, and mounting onto dicing frames. Ready for the most demanding thin-wafer application, including Taiko wafers, Takatori has been producing tape, detape, and mounting equipment for over 25 years.
Low cost, high performance bonding and de-bonding/mounting of wafers using double sided tape.
Metal liftoff, backside lamination, UV exposure, and more. Takatori is ready to work with you on new applications as well, drawing on 25 years of experience with a wide variety of applications.