For 25 years Takatori has been delivering machines to the semiconductor industry. Their core application is protective tape lamination prior to backgrinding, along with tape removal after grinding and wafer mounting. In this area Takatori can provide solutions for the most demanding thin-wafer applications, including Taiko.

Takatori has taken their decades-long expertise in this area and expanded to the lamination of advanced films including dry film, DAF, and NCF. They also offer specialized equipment for wafer bonding, UV exposure, and metal lift-off.

  • Shows and Meeting Schedule

    1. SEMICON West 2018

      July 10 - July 12
    2. European Conference on SiC and Related Materials

      September 2 - September 6
    3. IMTS 2018

      September 10 - September 15
  • Contact GTI