• Cutting Composites with Diamond Wire

    Diamond wire has been used for many years by companies looking to cut very hard materials, particularly sapphire, into thin wafers. Producers needed a fast cutting method that minimized material loss and damage, and diamond wire delivered. Takatori has taken decades of wire saw experience in hard materials and created a small, flexible wire saw…

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  • Takatori Slicing Solutions for R&D and Pilot Production

    The WSD-K2 and WSD-K3 deliver Takatori slicing quality and reliability for customers looking for smaller-scale slicing capability. Whether used for pilot production, material R&D, or process development, the K2 and K3 offer a powerful, flexible solution to customers not yet ready for a production-scale machine. It also finds use at production facilities for development purposes,…

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