News

  • Welcome to Daniel Gillis, our new Field Service Engineer.

    GTI Technologies is pleased to announce the hiring of Daniel Gillis as our newest Field Service Technician. Dan will primarily be responsible for servicing our multi-wire saw customers, focusing on new machine installations and field service. Dan joins GTI after working as a Field Service Technician at Doosan Fuel Cell America and as an Aircraft Electrician for the Connecticut Army National Guard. Dan will spend the next few months working closely with our experienced Field…

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  • Wiresaws: 5 Best Practices for Fast Changeovers & Maximum Run Times

    Get Maximum Productivity from your Takatori Wire Saw with these 5 Best Practices You'll get the most out of your Takatori wire saw when you follow this guide to best maintaining and repairing these five crucial parts. The result will be faster changeovers and maximum machine run time. A key concept to remember is that the cycle time on a multi-wire saw is often quite long and operator intervention is rarely required, so you should…

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  • 40 Years of Manufacturing Excellence

    For 40 years, GTI has been evolving to provide advanced manufacturing solutions to its customers. When the company opened its doors on Oct. 1, 1978, Grinding Technology Inc. focused not only on importing leading-edge metalworking equipment from Europe to the United States; but also on supporting customers once their machines were up and running. About 10 years later, the company began to branch out into the semiconductor industry, working with GMN to sell wafer grinders. This included…

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  • Takatori Temporary Bonding Solutions

    Developments in advanced packaging and 3D integration have driven the demand for better ways to work with ultra-thin wafers safely. The need to run thin wafers through processes beyond the standard post-grinding steps (like polishing, detaping and dicing) has driven demand for cost-effective ways to bond ultra-thin wafers to a carrier made of sapphire, glass, silicon, or other materials. Many temporary bonding methods have featured spin-on adhesive, which requires complex, expensive machines. In 2003, Takatori…

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  • New Concepts for Cutting Core Materials

    Diamond wire, originally developed for cutting hard, crystalline materials, offers a new solution for cutting core materials. The technology provides numerous advantages over traditional technologies including multi-axis machining centers and bandsaws. It is an effective tool for cutting a wide variety of materials quickly and efficiently. Diamond wire technology: 1. Reduces Damage - Diamond wire cutting, while effective for even the hardest materials, is a relatively gentle process when compared to the more aggressive, traditional machining methods.…

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  • What Is Diamond Wire?

    Diamond wire, originally adopted for mass production by the sapphire industry and then by the silicon industry, significantly increases the productivity of wire sawing and provides downstream benefits as well. It also offers an interesting option for cutting composite materials: demonstrating advantages when cutting both core materials and carbon fiber. Diamond wire is made in a number of ways, but the most common way is by attaching fine diamond particles to steel wire through an…

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  • Takatori Annual Distributor Meeting

    This week Takatori conducted their annual distributor meeting a t their factory in Kashihara City, Japan. GTI was there along with distributors from across Asia to learn about Takatori’s latest innovations and to hear about markets all over the world. In the multi-wire saw business Takatori presented the new MWS-620DD, a large capacity multi-wire saw built for high production slicing of hard materials. The machine features a longer work envelope, highly rigid construction, and host…

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  • Installation guide for a Takatori Wire Saw from GTI

    You've made the investment in your new Takatori wire saw, and now we're here to help you make that machine a success. Good support is key, and with GTI it starts even before the new wire saw arrives. Here's a guide to the logistics of receiving and installing your new wire saw. These instructions must be followed to ensure a smooth installation and avoid any warranty issues. Please follow them closely. Preparing for the Arrival of…

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  • Cutting Composites with Diamond Wire

    Diamond wire has been used for many years by companies looking to cut very hard materials, particularly sapphire, into thin wafers. Producers needed a fast cutting method that minimized material loss and damage, and diamond wire delivered. Takatori has taken decades of wire saw experience in hard materials and created a small, flexible wire saw designed to be mounted on an industrial robot to cut composite materials. This is a new cutting method for composites,…

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  • Takatori Slicing Solutions for R&D and Pilot Production

    The WSD-K2 and WSD-K3 deliver Takatori slicing quality and reliability for customers looking for smaller-scale slicing capability. Whether used for pilot production, material R&D, or process development, the K2 and K3 offer a powerful, flexible solution to customers not yet ready for a production-scale machine. It also finds use at production facilities for development purposes, cutting seed crystals, and other applications that would otherwise occupy a production machine. Why choose this machine over the competition?…

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