• Takatori Temporary Bonding Solutions

    Developments in advanced packaging and 3D integration have driven the demand for better ways to work with ultra-thin wafers safely. The need to run thin wafers through processes beyond the standard post-grinding steps (like polishing, detaping and dicing) has driven demand for cost-effective ways to bond ultra-thin wafers to a carrier made of sapphire, glass,…

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  • New Concepts for Cutting Core Materials

    Diamond wire, originally developed for cutting hard, crystalline materials, offers a new solution for cutting core materials. The technology provides numerous advantages over traditional technologies including multi-axis machining centers and bandsaws. It is an effective tool for cutting a wide variety of materials quickly and efficiently. Diamond wire technology: 1. Reduces Damage – Diamond wire cutting, while…

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  • What Is Diamond Wire?

    Diamond wire, originally adopted for mass production by the sapphire industry and then by the silicon industry, significantly increases the productivity of wire sawing and provides downstream benefits as well. It also offers an interesting option for cutting composite materials: demonstrating advantages when cutting both core materials and carbon fiber. Diamond wire is made in…

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  • Takatori Annual Distributor Meeting

    This week Takatori conducted their annual distributor meeting a t their factory in Kashihara City, Japan. GTI was there along with distributors from across Asia to learn about Takatori’s latest innovations and to hear about markets all over the world. In the multi-wire saw business Takatori presented the new MWS-620DD, a large capacity multi-wire saw…

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  • Installation guide for a Takatori Wire Saw from GTI

    You’ve made the investment in your new Takatori wire saw, and now we’re here to help you make that machine a success. Good support is key, and with GTI it starts even before the new wire saw arrives. Here’s a guide to the logistics of receiving and installing your new wire saw. These instructions must be…

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  • Cutting Composites with Diamond Wire

    Diamond wire has been used for many years by companies looking to cut very hard materials, particularly sapphire, into thin wafers. Producers needed a fast cutting method that minimized material loss and damage, and diamond wire delivered. Takatori has taken decades of wire saw experience in hard materials and created a small, flexible wire saw…

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  • Takatori Slicing Solutions for R&D and Pilot Production

    The WSD-K2 and WSD-K3 deliver Takatori slicing quality and reliability for customers looking for smaller-scale slicing capability. Whether used for pilot production, material R&D, or process development, the K2 and K3 offer a powerful, flexible solution to customers not yet ready for a production-scale machine. It also finds use at production facilities for development purposes,…

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