• GTI Semicon West 2018 – Wrap Up

    GTI participated in Semicon West 2018 in San Francisco, marking almost 30 years in the semiconductor industry. We met with numerous new customers, spent time with some of our most important existing customers, and met with our regional reps and other business partners. As always, Semicon West this year was packed with innovative products from…

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  • Semicon West 2018 – San Francisco

    Visit GTI Technologies at Booth 825 at SEMICON West to learn more about Takatori semiconductor process equipment and multi wire saws. The show runs July 10-12 at the Moscone Convention Center in San Francisco, CA. SEMICON West is the premier annual event for the global microelectronics industry, highlighting the latest innovations, products, processes and services for the design and manufacture…

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  • Metal Liftoff – A Effective Alternative to Chemical Etching

    Many semiconductor devices particularly those made with gallium arsenide (GaAs) or indium phosphide (InP), require the removal of metal layers by etching. Gold, for example, difficult and expensive to remove by etching due to its inertness. Lift off provides an alternative to etching. A pattern is first created in a sacrificial layer of photoresist before…

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  • Custom Semiconductor Solutions

    In the constantly evolving world of semiconductor manufacturing, customers often seek special machines for new applications. For decades GTI and Takatori have provided customers with special machines customized to meet their specific needs. Takatori is able to add many optional features to their machines, including Bernoulli-type end effectors, OCR/BCR, special cassettes for thin wafers and…

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  • Takatori TEAM – Vacuum Lamination for Advanced Films

    Tape lamination has moved far beyond the standard backgrinding application, as companies have created new films for MEMS, TSV, bumps, pillars, and other advanced packaging applications. The Takatori TEAM approach provides the most innovative and capable solution for laminating these films, providing the highest quality lamination for the most demanding applications. Vacuum Lamination: Standard tape…

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  • GTI at CS International 2018

    GTI exhibited together with our European partner JTA at the two day CS International show April 10 & 11, 2018 in Brussels Belgium. The conference was well attended by both equipment vendors and customers. There was a great deal of interest around SiC-based devices, and the general forecast was for continued growth in the future,…

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  • Welcome to Daniel Gillis, our new Field Service Engineer.

    GTI Technologies is pleased to announce the hiring of Daniel Gillis as our newest Field Service Technician. Dan will primarily be responsible for servicing our multi-wire saw customers, focusing on new machine installations and field service. Dan joins GTI after working as a Field Service Technician at Doosan Fuel Cell America and as an Aircraft…

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  • Wiresaws: 5 Best Practices for Fast Changeovers & Maximum Run Times

    Get Maximum Productivity from your Takatori Wire Saw with these 5 Best Practices You’ll get the most out of your Takatori wire saw when you follow this guide to best maintaining and repairing these five crucial parts. The result will be faster changeovers and maximum machine run time. A key concept to remember is that…

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  • 40 Years of Manufacturing Excellence

    For 40 years, GTI has been evolving to provide advanced manufacturing solutions to its customers. When the company opened its doors on Oct. 1, 1978, Grinding Technology Inc. focused not only on importing leading-edge metalworking equipment from Europe to the United States; but also on supporting customers once their machines were up and running. About 10 years…

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  • Takatori Temporary Bonding Solutions

    Developments in advanced packaging and 3D integration have driven the demand for better ways to work with ultra-thin wafers safely. The need to run thin wafers through processes beyond the standard post-grinding steps (like polishing, detaping and dicing) has driven demand for cost-effective ways to bond ultra-thin wafers to a carrier made of sapphire, glass,…

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  • Shows and Meeting Schedule

    1. European Conference on SiC and Related Materials

      September 2 - September 6
    2. IMTS 2018

      September 10 - September 15
    3. CAMX 2018 – Dallas

      October 15 - October 18
  • Contact GTI