News, Semiconductor Slicing

GTI Technologies COVID-19 Response
October 1, 2020
GTI has remained in operation throughout the current emergency, providing spare parts, consumables, and phone support to our customers in order to keep machines running. We remain open during regular business hours (Monday through Friday, 8am to 5pm Eastern Time) though our staff is often working from home in order to minimize the potential for exposure. As of October 1st, sales travel remains restricted, but we are performing service with limitations; travel outside of the…
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Visit GTI at NEPCON 2020
November 1, 2019
Come visit Takatori at the 34th Annual Electronics R&D, Manufacturing, and Packaging Technology Expo - NEPCON 2020 Japan. NEPCON is composed of a number of shows, each showcasing the latest in electronics manufacturing equipment, advanced materials, and more.
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Visit GTI at Semicon Europa 2019
September 9, 2019
The Largest European Electronics Platform Connecting Industry Leaders across the Entire Manufacturing Supply Chain SEMICON Europa attracts a highly influential audience from every segment and sector of the European microelectronics industries including semiconductors, LEDs, MEMS, printed/ organic/ flexible, and other adjacent markets. Exhibitor and attendees meet to enact change and address industry-shaping trends. After a successful SEMICON Europa 2018, we now look forward to welcoming you in Munich at SEMICON Europa November 12-15 2019!
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Visit Takatori and GTI at the International Conference on Silicon Carbide and Related Materials
July 12, 2019
Takatori will have a booth at the International Conference on Silicon Carbide and Related Materials in Kyoto, Japan September 29 to October 4, 2019. The ICSCRM is the premier forum for technical discussion in all areas of silicon carbide (SiC) and other wide bandgap (WBG) semiconductors. The topics covered in the ICSCRM include bulk and epitaxial growth, fundamental physical properties, defect characterization and engineering, quantum technology, surfaces and interfaces, device fabrication processes, devices (high-power, high-temperature,…
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Wire Sawing vs Other Cutting Methods
December 18, 2018
Wire sawing, whether using abrasive slurry or diamond wire, offers distinct advantages over other cutting methods in many applications. The high precision, reduced kerf loss, and reduced damage of wire sawing can have a substantial effect not only on the cutting process, but also on downstream operations. Reduced Kerf Loss: The first advantage of wire sawing is reduced kerf loss (the material lost during cutting). Compared with ID saws (0.300 to 0.500mm kerf) and diamond…
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Keeping Your Wiresaw Running Well
August 22, 2018
Takatori Multiwire Saws are designed for years of high-volume production with many customers are running their machines around the clock. The machines require regular attention to maintain this high level of productivity and here are a few tips on what to do. GTI Engineering and Service Visits Every new technology purchase has a learning curve; think about a new computer, a new phone, anything new. When you are new to your wiresaw, the best…
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GTI Semicon West 2018 – Wrap Up
August 1, 2018
GTI participated in Semicon West 2018 in San Francisco, marking almost 30 years in the semiconductor industry. We met with numerous new customers, spent time with some of our most important existing customers, and met with our regional reps and other business partners. As always, Semicon West this year was packed with innovative products from companies all over the world. A number of keynote speakers hit on the key technologies driving our industry today, including…
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Metal Liftoff – A Effective Alternative to Chemical Etching
June 12, 2018
Many semiconductor devices particularly those made with gallium arsenide (GaAs) or indium phosphide (InP), require the removal of metal layers by etching. Gold, for example, difficult and expensive to remove by etching due to its inertness. Lift off provides an alternative to etching. A pattern is first created in a sacrificial layer of photoresist before the gold is the deposited. The gold adheres strongly to the underlying device layers of GaAs (or deposited insulating layers,)…
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Custom Semiconductor Solutions
May 30, 2018
In the constantly evolving world of semiconductor manufacturing, customers often seek special machines for new applications. For decades GTI and Takatori have provided customers with special machines customized to meet their specific needs. Takatori is able to add many optional features to their machines, including Bernoulli-type end effectors, OCR/BCR, special cassettes for thin wafers and more, but our ability to customize goes far beyond adding options. Recently, a customer came to GTI seeking a solution…
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Takatori TEAM – Vacuum Lamination for Advanced Films
April 30, 2018
Tape lamination has moved far beyond the standard backgrinding application, as companies have created new films for MEMS, TSV, bumps, pillars, and other advanced packaging applications. The Takatori TEAM approach provides the most innovative and capable solution for laminating these films, providing the highest quality lamination for the most demanding applications. Vacuum Lamination: Standard tape lamination generally rolls tape onto a wafer, but to achieve the highest quality lamination it is often better to laminate…
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