Developments in advanced packaging and 3D integration have driven the demand for better ways to work with ultra-thin wafers safely. The need to run thin wafers through processes beyond the standard post-grinding steps (like polishing, detaping and dicing) has driven demand for cost-effective ways to bond ultra-thin wafers to a carrier made of sapphire, glass, silicon, or other materials.
Many temporary bonding methods have featured spin-on adhesive, which requires complex, expensive machines.
In 2003, Takatori began offering its WSM-series machines, providing a unique temporary bonding solution featuring double-sided tape. Unfortunately, the double-sided tapes available at that time were not capable of surviving high-temperature processes, and this limited the appeal of Takatori’s new machine.
Fortunately double-sided tapes have continued to evolve, and today both Nitto’s Revalpha and Sekisui’s Selfa tapes can survive higher temperatures while maintaining good adhesion and allowing for easy debonding.
Today, Takatori’s WSM-100 offers a cost-effective solution for temporary bonding. The machine uses a combination of atmospheric lamination and vacuum bonding, and works with many types of carrier wafers and different tapes. Today’s tapes are either heat-release or UV-release, and both types are supported by Takatori’s debonding/mounting tool, the WSM-200.
Call GTI Technologies today at +1 (203) 929-2200 or contact us via the web at www.gti-usa.com to find out how the WSM-series of machines can address your temporary bonding needs.