This week Takatori conducted their annual distributor meeting a t their factory in Kashihara City, Japan. GTI was there along with distributors from across Asia to learn about Takatori’s latest innovations and to hear about markets all over the world.
In the multi-wire saw business Takatori presented the new MWS-620DD, a large capacity multi-wire saw built for high production slicing of hard materials. The machine features a longer work envelope, highly rigid construction, and host of other improvements. While originally designed for diamond wire cutting of sapphire ingots, the machine will soon be available for slurry slicing as well, opening the door to new possibilities.
The semiconductor division showed the latest in solutions for advanced packaging applications. As many companies move forward with WLCSP processes Takatori continues to show new machines to meet their demands. They remain the most flexible manufacturer of lamination, de-lamination, and mounting tools, willing to work closely with customers to create the best solution for their application.