For 40 years, GTI has been evolving to provide advanced manufacturing solutions to its customers. When the company opened its doors on Oct. 1, 1978, Grinding Technology Inc. focused not only on importing leading-edge metalworking equipment from Europe to the United States; but also on supporting customers once their machines were up and running.

About 10 years later, the company began to branch out into the semiconductor industry, working with GMN to sell wafer grinders. This included the MPS-T500, the first fully automatic, cassette to cassette wafer backgrinder brought to market. In order to provide a complete solution to semiconductor companies, GTI entered a partnership with Takatori to provide tape, detape, and mounting equipment in 1989.

As the business evolved and the semiconductor industry continued to grow, Grinding Technology Inc. re-branded itself as GTI Technologies, Inc., in 1997 reflecting its diversification. The partnership with Takatori also grew deeper as GTI began to offer their new multi wire saws.

By 2000 GTI’s business was almost solely focused on the semiconductor and advanced materials businesses, and this remains our focus today.

GTI led the way to develop wire slicing of mono-crystalline sapphire and silicon carbide. Working together with customers, GTI helped to pave the way for the blue and white LED revolution, and played a key role in the rapid growth of today’s advanced power devices. The company continues to provide advanced solutions for leading semiconductor companies in North America and Europe.

We thank our customers and our suppliers for their support over the last 40 years, and we look forward to working together to make a better future.